Title:
How to improve the mobility of a polyamide resin composition
Document Type and Number:
Japanese Patent JP5977598
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a polyamide resin composition having excellent heat resistance aging properties, and enhanced thermal stability.SOLUTION: A polyamide resin composition contains (A) a polyamide resin, and (B) a crystalline phenol compound which has a branched structure (i), and contains three or more phenolic hydroxyl groups in a molecule (ii).
Inventors:
Kazunori Terada
Fujino Nogi
Fujino Nogi
Application Number:
JP2012141356A
Publication Date:
August 24, 2016
Filing Date:
June 22, 2012
Export Citation:
Assignee:
ASAHI KASEI KABUSHIKI KAISHA
International Classes:
B29C45/00; C08K3/00; C08K5/13; C08L77/00
Domestic Patent References:
| JP11065107A | ||||
| JP11258795A | ||||
| JP2007070528A | ||||
| JP11315205A | ||||
| JP61145223A | ||||
| JP2003277605A | ||||
| JP57200455A | ||||
| JP4085324A | ||||
| JP64074213A | ||||
| JP8319385A | ||||
| JP48008737A |
Foreign References:
| US5410015 |
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito
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