Title:
超電導線材の接合方法
Document Type and Number:
Japanese Patent JP6662886
Kind Code:
B2
Abstract:
A superconducting wire joining method joins superconducting wires each having a superconducting layer and a stabilizing layer that contacts with the superconducting layer to cover the superconducting layer. The superconducting wire joining method includes overlapping the superconducting wires such that the stabilizing layers of the superconducting wires face each other, and performing ultrasonic joining relative to overlapped portions of the superconducting wires. The overlapping of the superconducting wires and the performing of the ultrasonic joining are performed at room temperature.
Inventors:
Seiki Mori
Application Number:
JP2017539208A
Publication Date:
March 11, 2020
Filing Date:
September 08, 2016
Export Citation:
Assignee:
Toray Engineering Co., Ltd.
International Classes:
H01B13/00; B23K20/10; H01B12/06; H01F6/06; H01R4/68
Domestic Patent References:
| JP11067523A | ||||
| JP11317118A | ||||
| JP2011529255A |