Title:
表示装置の作製方法
Document Type and Number:
Japanese Patent JP4637588
Kind Code:
B2
Abstract:
The present invention provides a simplifying method for a peeling process as well as peeling and transcribing to a large-size substrate uniformly. A feature of the present invention is to peel a first adhesive and to cure a second adhesive at the same time in a peeling process, thereby to simplify a manufacturing process. In addition, the present invention is to devise the timing of transcribing a peel-off layer in which up to an electrode of a semiconductor are formed to a predetermined substrate. In particular, a feature is that peeling is performed by using a pressure difference in the case that peeling is performed with a state in which plural semiconductor elements are formed on a large-size substrate.
Inventors:
Shunpei Yamazaki
Toru Takayama
Junya Maruyama
Yugo Goto
Yumiko Ohno
Toru Takayama
Junya Maruyama
Yugo Goto
Yumiko Ohno
Application Number:
JP2004566294A
Publication Date:
February 23, 2011
Filing Date:
December 24, 2003
Export Citation:
Assignee:
Semiconductor Energy Laboratory Co., Ltd.
International Classes:
G09F9/30; G02F1/13; G02F1/136; G02F1/1368; G09F9/00; H01L21/02; H01L21/20; H01L21/336; H01L21/77; H01L21/84; H01L27/12; H01L27/32; H01L29/786; H05B33/14; H05B44/00
Domestic Patent References:
| JPH11265155A | 1999-09-28 | |||
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Foreign References:
| WO2002084739A1 | 2002-10-24 |