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Title:
発光装置の作製方法
Document Type and Number:
Japanese Patent JP5042163
Kind Code:
B2
Abstract:

To provide a flexible light emitting device which has resistance to an impact from an external part, and to provide a method for manufacturing the device.

Durability against an impact from an external part is raised by allowing a light emitting device to have a structure including: the first element formation layer having a TFT, etc., formed by holding a structure body, which is obtained by impregnating a fiber body with an organic resin, between a pair of flexible substrates; and the second element formation layer having a light emitting element, etc. The first and second element formation layers are electrically connected via wiring which is formed inside the structure body. The wiring is formed inside the structure body without forming an opening in the structure body, so as to be formed without reducing a function as the impact-resistance layer of the structure body.

COPYRIGHT: (C)2010,JPO&INPIT


Inventors:
Tetsushi Seo
Kaoru Tsuchiya
Takaaki Nagata
Akihiro Senda
Application Number:
JP2008211269A
Publication Date:
October 03, 2012
Filing Date:
August 20, 2008
Export Citation:
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Assignee:
Semiconductor Energy Laboratory Co., Ltd.
International Classes:
H01L51/50; G09F9/30; H01L27/32; H05B33/04; H05B33/10; H05B33/26
Domestic Patent References:
JP2008124448A
JP2002329584A
JP2005140976A
JP2005140818A
JP2005109307A



 
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