Title:
構造体の作製方法
Document Type and Number:
Japanese Patent JP5675939
Kind Code:
B2
Abstract:
An object is to increase resistance against an electrostatic breakdown and to increase resistance to an external stress. Another object is to reduce cost by simplifying the manufacturing process. In a step in which an element formation layer (103) is provided between a first organic resin layer (104) provided with a first conductive film (107) on its surface and a second organic resin layer (108) provided with a second conductive film (111) on its surface to electrically connect the first conductive film (107) and the second conductive film (111) with a contact conductor (106,110) formed in each of the organic resin layers, the contact conductor (106,110) provided in each of the first organic resin layer (104) and the second organic resin layer (108) is manufactured by making paste (105) penetrate before an organic resin is cured and then curing the organic resin layer.
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Inventors:
千田 章裕
永田 貴章
永田 貴章
Application Number:
JP2013247344A
Publication Date:
February 25, 2015
Filing Date:
November 29, 2013
Export Citation:
Assignee:
株式会社半導体エネルギー研究所
International Classes:
H01L21/56; G06K19/07; G06K19/077; H01L21/822; H01L23/12; H01L27/04; H05K3/40