ヒートシンク付パワーモジュール用基板およびヒートシンク付パワーモジュール用基板の製造方法

Title:

ヒートシンク付パワーモジュール用基板およびヒートシンク付パワーモジュール用基板の製造方法

Document Type and Number:

Japanese Patent JP7043794

Kind Code:

B2

Abstract:

A power module substrate with a heat sink (10) includes a power module substrate (20) provided with an insulating substrate (21), a circuit layer (22) provided on one surface of the insulating substrate (21) and a metal layer (23) provided on the other surface of the insulating substrate (21); and a heat sink (40) bonded via a bonding layer (30) to a surface on an opposite side to the insulating substrate (21) of the metal layer (23) of the power module substrate (20), in which the bonding layer (30) is a sintered body of silver particles, a porous body having a relative density in a range of 60% or more and 90% or less, and has a thickness in a range of 10 µm or more and 500 µm or less.

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Inventors:

山▲崎▼ 和彦
Kotaro Masuyama
Tatsuya Numa
Ishikawa Masayuki

Application Number:

JP2017213917A

Publication Date:

March 30, 2022

Filing Date:

November 06, 2017

Export Citation:

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Assignee:

Mitsubishi Materials Corporation

International Classes:

H01L23/36; B22F1/107; H01L23/12; H01L23/13; H01L25/07; H01L25/18; H05K7/20; B22F1/102

Domestic Patent References:

JP8335652A
JP2017084921A
JP2013125779A
JP2015115521A
JP2013182901A
JP9162336A
JP2008198706A

Foreign References:

WO2015029511A1
WO2014034306A1

Attorney, Agent or Firm:

Yasushi Matsunuma
Mitsuo Teramoto
Fumihiro Hosokawa
Kazunori Onami

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