How to manufacture the ceramic printed circuit board consisting of the ceramic substrate which has the beer in which it filled up with metal

Title:

How to manufacture the ceramic printed circuit board consisting of the ceramic substrate which has the beer in which it filled up with metal

Document Type and Number:

Japanese Patent JP6231079

Kind Code:

B2

Abstract:

A method for producing ceramic circuit boards from ceramic substrates having metal-filled vias. In order to be able to fill the vias by means of a single filling process, either a planar copper metallization is applied on one side to the ceramic substrate having vias by means of scren printing, or a copper film of 100-300 μm is bonded on one side to the ceramic substrate having vias in a DCB/DBC process and the vias are filled from the ceramic side by means of an electrogalvanic process in a copper bath by the deposition of copper.

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Inventors:

Dietmar Jenich

Application Number:

JP2015509420A

Publication Date:

November 15, 2017

Filing Date:

April 30, 2013

Export Citation:

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Assignee:

CeramTec GmbH

International Classes:

H05K3/40; C25D5/20; C25D7/00; H05K3/18

Domestic Patent References:

JP2010077496A
JP2011238772A
JP2004300462A
JP2004103798A
JP2012531728A
JP2004259795A
JP2006111896A

Foreign References:

WO2011000360A1
US6093443

Attorney, Agent or Firm:

Einzel Felix-Reinhard
Takuya Kuno

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