Title:
How to manufacture a flexible micro electronic system and a flexible micro electronic system
Document Type and Number:
Japanese Patent JP6182761
Kind Code:
B2
Abstract:
Microelectronic systems encapsulated in a stretchable/flexible material, which is skin/bio-compatible and able to withstand environmental conditions. In one embodiment of the present description, the microelectronic system includes a microelectronic device that is substantially encapsulated in a non-permeable encapsulant, such as, butyl rubbers, ethylene propylene rubbers, fluoropolymer elastomers, or combinations thereof. In another embodiment, the microelectronic system includes a microelectronic device that is substantially encapsulated in a permeable encapsulant, such as polydimethylsiloxane, wherein a non-permeable encapsulant substantially encapsulates the permeable encapsulant.
Inventors:
Alexob, alexander
Sene Villa Toni, Dylan
Gulmuru tea, chalabana k.
Shen, Chin-Pin Jay.
Sobieski, Daniel N.
Sene Villa Toni, Dylan
Gulmuru tea, chalabana k.
Shen, Chin-Pin Jay.
Sobieski, Daniel N.
Application Number:
JP2015075557A
Publication Date:
August 23, 2017
Filing Date:
April 02, 2015
Export Citation:
Assignee:
INTEL CORPORATION
International Classes:
H01L23/29; A44C5/00; C08L21/00; C08L23/00; C08L83/04; H01L23/31
Domestic Patent References:
| JP8153832A | ||||
| JP2016504765A | ||||
| JP2009051876A |
Foreign References:
| US20060231288 | ||||
| WO1995026047A1 | ||||
| WO2010086416A1 |
Attorney, Agent or Firm:
Longhua International Patent Service Corporation
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