Title:
集積回路パッケージを製造する方法
Document Type and Number:
Japanese Patent JP4658772
Kind Code:
B2
Abstract:
A carrier assembly for an integrated circuit is disclosed. The carrier assembly has a retainer with electrical contacts for receiving the integrated circuit, and island defining portions arranged about the retainer. Each island defining portion is connected to neighboring island defining portions through a serpentine member. This connection allows resilient deflection between the island defining portions.
Inventors:
Silverbrook, Kaia
Application Number:
JP2005308766A
Publication Date:
March 23, 2011
Filing Date:
October 24, 2005
Export Citation:
Assignee:
Silverbrook Research Pty Limited
International Classes:
H01L23/12; H01L21/48; H01L23/13; H01L23/14; H01L23/498; H05K1/02; H05K3/34
Domestic Patent References:
| JP2002110850A | ||||
| JP9045809A | ||||
| JP11176870A | ||||
| JP11135675A | ||||
| JP1258458A | ||||
| JP6085010A |
Foreign References:
| WO1999065075A1 | ||||
| WO1998028793A1 | ||||
| WO1999059206A1 |
Attorney, Agent or Firm:
Yuichi Yamada
Masakazu Noda
Masakazu Noda