Title:
入出力回路が内蔵された電力増幅器用パッケージの製造方法
Document Type and Number:
Japanese Patent JP7102525
Kind Code:
B2
Abstract:
A method of manufacturing a power amplifier package embedded with an input-output circuit including a dielectric circuit board, a heat sink and lead frames, the method comprising: the step of preparing the dielectric circuit board including the steps of forming a power amplifier hole in which a power amplifier chip is to be disposed on a dielectric substrate, printing an input matching network metal pattern on a left side of the power amplifier hole, and printing an output matching network metal pattern on a right side of the power amplifier hole, and sintering the input matching network metal pattern and the output matching network metal pattern printed on the dielectric substrate; the step of preparing the lead frames by etching alloy 42 and plating nickel; and the step of attaching the heat sink on a bottom surface of the dielectric circuit board.
Inventors:
Lee, Sun-Hun
Han, Kyujin
Han, Kyujin
Application Number:
JP2020533283A
Publication Date:
July 19, 2022
Filing Date:
November 29, 2018
Export Citation:
Assignee:
Costecsys Company Limited
International Classes:
H01L23/12; H01L23/50
Domestic Patent References:
| JP7046007A | ||||
| JP2004253714A | ||||
| JP2002252319A | ||||
| JP2015527730A |
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Osamu Miyazaki
Tadahiko Ito
Osamu Miyazaki
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