Title:
センサユニットの製造方法
Document Type and Number:
Japanese Patent JP5857932
Kind Code:
B2
Abstract:
A sensor unit with a sensing surface molded properly on an outer surface of a sensor receiving part is provided. The sensor unit includes a resin casing formed with an annular fixing member, and a sensor receiving part formed in the casing for receiving a sensor housed. A sensing surface that faces a target object is formed within the sensor receiving part. A resin charging position in molding the casing is set to a position deviated circumferentially from a central position in a width of the sensing surface. In particular, resin is charged into the fixing member from a gate arranged on an extending line of a first through-bore formed in a position corresponding to the charging position.
Inventors:
Koji Kawasaki
Kazuhiro Adachi
Kouichi Okamura
Kazuhiro Adachi
Kouichi Okamura
Application Number:
JP2012221585A
Publication Date:
February 10, 2016
Filing Date:
October 03, 2012
Export Citation:
Assignee:
Aisin Seiki Co., Ltd.
International Classes:
G01P1/02; B29C45/14; G01D5/245
Domestic Patent References:
| JP2010125822A | ||||
| JP2010043888A | ||||
| JP2005233849A | ||||
| JP2009264941A |
Foreign References:
| WO2012114703A1 |
Attorney, Agent or Firm:
Shuichiro Kitamura
Mountain Saki Tetsuya
Mountain Saki Tetsuya