Title:
イメージセンサのウエハレベルチップスケールパッケージの製造方法
Document Type and Number:
Japanese Patent JP4472682
Kind Code:
B2
Abstract:
Provided are a WLCSP of an image sensor and a method of manufacturing the same. The WLCSP includes a wafer, support members, glass, and metal bumps. The wafer has an image sensor and a pair of pads disposed thereon, a portion of the bottom surface of the image sensor being exposed outward from the both ends of the wafer. The support members are disposed on the pads to support the both bottom sides of the glass, the support members being formed to a predetermined thickness to provide a space for forming an air cavity. The glass is safely seated on the support members such that the air cavity is formed on the wafer. The metal bumps are disposed on the both sides of the wafer corresponding to the pads such that the bottom surfaces of the metal bumps protrude beyond the bottom surface of the wafer and form conductive lines electrically connected to the pads. Therefore, the package can be directly attached to a camera module even without using a separate PCB or ceramic substrate. Accordingly, the module assembly space can be reduced to miniaturize the product. Also, the substrate manufacturing costs can be reduced to lower the unit price of the product.
Inventors:
Jin Moon Ryu
Application Number:
JP2006276263A
Publication Date:
June 02, 2010
Filing Date:
October 10, 2006
Export Citation:
Assignee:
Samsung Electric Co., Ltd.
International Classes:
H01L23/12; H01L23/02; H01L23/04; H01L27/14; H04N5/335
Domestic Patent References:
| JP2003116066A | ||||
| JP2004088082A | ||||
| JP2004207461A | ||||
| JP2005203752A |
Attorney, Agent or Firm:
Konobu Kato