Title:
コンタクト開口の製造を監視して検査する方法
Document Type and Number:
Japanese Patent JP4601295
Kind Code:
B2
Abstract:
A method for production testing includes receiving a wafer including a semiconductor substrate and a non-conducting layer formed over the substrate, following etching of contact openings through the non-conducting layer to the substrate, the contact openings including an array of the contact openings arranged in a predefined test pattern in a test area on the wafer. An electron beam is directed to irradiate the test area, a specimen current flowing through the substrate responsive to the electron beam is measured. The specimen current is analyzed so as to assess a dimension of the contact openings.
Inventors:
Kadishevich, Alexander
Simon, avi
Simon, avi
Application Number:
JP2003566897A
Publication Date:
December 22, 2010
Filing Date:
February 04, 2003
Export Citation:
Assignee:
Applied Materials Israel Limited
International Classes:
H01L21/66; H01L23/544
Domestic Patent References:
| JP10281746A | ||||
| JP2000174077A | ||||
| JP2001156136A |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Ikeda adult
Yuichi Yamada
Ikeda adult
Yuichi Yamada