Title:
基板の研磨の進捗を監視する方法および研磨装置
Document Type and Number:
Japanese Patent JP5612945
Kind Code:
B2
Abstract:
A method of monitoring progress of polishing of a substrate having at least two regions including a first region and a second region with different structures is provided. The method includes: applying light to plural measurement points on the substrate during polishing of the substrate; receiving reflected light from each measurement point; measuring intensity of the reflected light; producing a spectrum of the reflected light from the intensity; classifying the spectrum as spectrum of the reflected light from the first region or as spectrum of the reflected light from the second region based on a shape of the spectrum or the intensity of the reflected light; and monitoring progress of polishing of the substrate based on a temporal change in the spectrum of the reflected light from the first region.
Inventors:
金馬 利文
Application Number:
JP2010165782A
Publication Date:
October 22, 2014
Filing Date:
July 23, 2010
Export Citation:
Assignee:
株式会社荏原製作所
International Classes:
H01L21/304; B24B37/013; B24B49/04; B24B49/12
Attorney, Agent or Firm:
Isamu Watanabe
Kosugi Ryoji
Tetsuya Hirozawa
Kosugi Ryoji
Tetsuya Hirozawa