Title:
部品付プリント基板の処理方法及び部品付プリント基板からの有価金属の回収方法
Document Type and Number:
Japanese Patent JP6846972
Kind Code:
B2
Abstract:
To provide: a processing method for a printed circuit board with a component for improving recovery efficiency of scrap of the print circuit board from the printed circuit board with the component; and a recovery method for valuable metal from the printed circuit board with the component for improving recovery efficiency of the valuable metal from the printed circuit board with the component.SOLUTION: A processing method for a printed circuit board with a component includes the steps of: breaking the printed circuit board with the component by an impact type rotary crusher; separating, by magnetic force, broken substances into a magnetic matter and a non-magnetic material; and after the non-magnetic material is sieved with a sieve of an opening of 10 mm to 20 mm, for obtaining the substance on the sieve as scrap of the print circuit board.SELECTED DRAWING: Figure 1
Inventors:
Akira Mori Hideyuki
Takayuki Kidera
Kazuhiro Nomura
Takayuki Kidera
Kazuhiro Nomura
Application Number:
JP2017069180A
Publication Date:
March 24, 2021
Filing Date:
March 30, 2017
Export Citation:
Assignee:
JX Nippon Mining & Metals Co., Ltd.
International Classes:
B09B5/00; B09B3/00; C22B7/00; C22B15/00
Domestic Patent References:
| JP2002153856A | ||||
| JP2001009435A | ||||
| JP7251154A |
Foreign References:
| WO2012131906A1 |
Attorney, Agent or Firm:
Shuhei Katayama