Title:
How to process the surface for protection
Document Type and Number:
Japanese Patent JP5951659
Kind Code:
B2
Abstract:
A method of treating a substrate by applying a layer of at least one metal to the substrate to form an applied metal layer on the substrate and followed by curing of the applied metal layer at sub-atmospheric pressure to form a metal protective layer. A method of treating a substrate by applying a layer of at least one metal to a substrate of an unassembled component of a reactor system to form an applied metal layer on the substrate of the unassembled component and curing the applied metal layer on the substrate of the unassembled component to form a metal protective layer. A method of treating a substrate by applying a layer of at least one metal to the substrate to form an applied metal layer, curing the applied metal layer at a first temperature and pressure for a first period of time, and curing the applied metal layer at a second temperature and pressure for a second period of time, wherein the curing forms a metal protective layer.
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Inventors:
Heiss, Robert El.
Scanlon, Jeffrey E.
Bergmeister The Third, Joseph
Knorr, Daniel Bee
Scanlon, Jeffrey E.
Bergmeister The Third, Joseph
Knorr, Daniel Bee
Application Number:
JP2014024742A
Publication Date:
July 13, 2016
Filing Date:
February 12, 2014
Export Citation:
Assignee:
Chevron Phillips Chemical Company LP
International Classes:
C23C24/08
Domestic Patent References:
| JP2001508355A | ||||
| JP11229030A | ||||
| JP10313005A | ||||
| JP58061268A | ||||
| JP61194170A | ||||
| JP2001220586A |
Attorney, Agent or Firm:
Asamura patent office
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