Title:
How to provide a terminal area between an electric conduction layer of a suspended particle device, and a power supply bus
Document Type and Number:
Japanese Patent JP6037328
Kind Code:
B2
Abstract:
A connection between a power bus and a conducting layer of a suspended particle device in accordance with an embodiment of the present application includes an adhesive combined with metallic particles to impart both good adhesion and electrical conductivity. The adhesive is applied to a surface of the conducting layer. A conducting copper foil or conducting fabric is adhered to the adhesive and forms at least a portion of the power bus.
Inventors:
Dong Yang Wan
Stephen M. Slovak
Robert El Sachs
Stephen M. Slovak
Robert El Sachs
Application Number:
JP2012537096A
Publication Date:
December 07, 2016
Filing Date:
October 29, 2010
Export Citation:
Assignee:
Research Frontiers Incorporated
International Classes:
G02F1/01
Domestic Patent References:
| JP2007525686A | ||||
| JP2007269959A | ||||
| JP7197001A | ||||
| JP2008233471A |
Attorney, Agent or Firm:
Yasuhiko Murayama
Shinya Mitsuhiro
Tatsuhiko Abe
Shinya Mitsuhiro
Tatsuhiko Abe