To provide a method by which useful metallic materials can be recovered without causing problems of safety and profitability when recycling a metallic material used for circuit pattern formation and electronic component mounting on a circuit board for electrical and electronic equipment.
The circuit board is brought into contact with an organic solvent by immersing the circuit board in an organic solvent tank storing the organic solvent. A polymer material on the circuit-board side, a polymer material on the side where a wiring is coated or fixed and a polymer material on the side where electronic components etc. are coated or fixed are swollen and/or dissolved by the organic solvent and collapsed relatively easily in the organic solvent. The metallic material can hereby be recovered from the circuit board.
COPYRIGHT: (C)2007,JPO&INPIT
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