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Title:
ステント溶接プロファイルを減ずる方法、溶接プロファイルを減じたステント、および、閉鎖式ワイヤ構成
Document Type and Number:
Japanese Patent JP4976286
Kind Code:
B2
Abstract:
A prosthesis including a composite wire forming a mesh, the mesh having a variable diameter wherein at least one end region has a larger diameter than a middle portion; the mesh having an exterior surface and an interior surface, wherein at least one of the surfaces is covered with silicone; and a retrieval loop positioned at at least one end of the mesh.

Inventors:
Clerk Claude O
Norton Paul Kay
Zupkovska Michael
Rina Gary Jay
Roberts George Tom
Application Number:
JP2007513248A
Publication Date:
July 18, 2012
Filing Date:
May 10, 2005
Export Citation:
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Assignee:
Boston Scientific Limited
International Classes:
A61F2/90; B23K9/00; B23K11/00; B23K15/00; B23K26/12; B23K26/20; B23K37/08; C23F3/04; C25F3/16
Domestic Patent References:
JP2003513748A
JP10244008A
Foreign References:
US6679980
US6264689
Attorney, Agent or Firm:
Sadao Kumakura
Fumiaki Otsuka
Shishido Kaichi
Disciple Maru Ken
Ino Sato



 
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