Title:
はんだ箇所におけるボイドの低減方法
Document Type and Number:
Japanese Patent JP6490223
Kind Code:
B2
Abstract:
The invention relates to a process to connect, by soldering, at least one electronic component (104, 204, 304, 404, 504) with a mounting plate (100, 200, 300, 400, 500), the mounting plate having at least one mounting plate contact surface (102, 202, 302, 402, 502) and the at least one electronic component having at least one component contact surface (105) corresponding to it, the at least one mounting plate contact surface being surrounded by a solder resist layer (101, 201, 301, 401, 501) that borders the at least one mounting plate contact surface, the process having the following steps: a) Applying solder paste (106, 206, 306, 406, 506) onto at least areas of the solder resist layer (101, 201, 301, 401, 501), minimally overlapping with the mounting plate contact surface (102, 202, 302, 402, 502) adjacent to the solder resist layer, b) Equipping the mounting plate with the at least one electronic component (104, 204, 304, 404, 504), the at least one component contact surface (105) at least partly covering the at least one mounting plate contact surface (102, 202, 302, 402, 502) corresponding to it; and c) Heating the solder paste (106, 206, 306, 406, 506) to produce a soldered connection between the mounting plate and the at least one component.
Inventors:
Ettlinger, Eric
Application Number:
JP2017532671A
Publication Date:
March 27, 2019
Filing Date:
November 18, 2015
Export Citation:
Assignee:
Zet Carve Group Game Behr
International Classes:
H05K3/34
Domestic Patent References:
| JP2005303079A | ||||
| JP2012059814A | ||||
| JP2011023484A |
Attorney, Agent or Firm:
Kato Asamichi
Kiuchi Uchida
Mitsuru Aoki
Kiuchi Uchida
Mitsuru Aoki