Title:
ＴＦＴ基板の断線修復方法
Document Type and Number:
Japanese Patent JP6734396
Kind Code:
B2
Abstract:
The present invention provides a broken line repair method of a TFT substrate. The method first finds out a broken line in the TFT substrate and a position of a broken point on the broken line. Then, positions of the passivation layer intersecting with the broken line at two ends of the broken point are processed, respectively to expose a metal layer, where the broken line is. Then, a temporary material layer is covered on the passivation layer and the metal layer which is exposed at the two ends of the broken point. Finally, a metal growing film is formed on the temporary material layer to connect the broken line of the two ends of the broken point. With the temporary material layer, the issue of bad repair result due to the remain of the color resist layer and the folding of the passivation layer can be solved.
Inventors:
Zhao Hee
Akira Katsunari
Akira Katsunari
Application Number:
JP2018555471A
Publication Date:
August 05, 2020
Filing Date:
June 20, 2016
Export Citation:
Assignee:
SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
International Classes:
G02F1/1368; G02F1/13; G02F1/1343; G09F9/00; G09F9/30
Domestic Patent References:
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Foreign References:
| WO2003081329A1 | ||||
| WO2012105180A1 | ||||
| WO2014054449A1 | ||||
| US20010035920 | ||||
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| KR1020130023642A |
Attorney, Agent or Firm:
try international patent corporation