Title:
逆に装着されたデバイスウェーハーをキャリヤー基板から分離する方法
Document Type and Number:
Japanese Patent JP5848205
Kind Code:
B2
Abstract:
New demounting methods and apparatuses for separating temporarily, permanently, or semi-permanently bonded substrates and articles formed from those methods and apparatuses are provided. The methods comprise demounting a device wafer from a carrier wafer or substrate that have only been strongly bonded at their outer perimeters. The edge bonds are chemically, mechanically, acoustically, or thermally softened, dissolved, or disrupted to allow the wafers to be easily separated with very low forces and at or near room temperature at the appropriate stage in the fabrication process. A clamp for facilitating separation of the bonded substrates is also provided.
Inventors:
Makachan Jeremy W.
Brown Robert Dee.
Brown Robert Dee.
Application Number:
JP2012165691A
Publication Date:
January 27, 2016
Filing Date:
July 26, 2012
Export Citation:
Assignee:
Brewer Science INC.
International Classes:
H01L21/683; H01L21/304
Domestic Patent References:
| JP2004079613A | ||||
| JP2008306049A | ||||
| JP2011510518A | ||||
| JP2009246195A | ||||
| JP2006079057A | ||||
| JP2010010207A |
Foreign References:
| WO2009094558A2 | ||||
| US20030015286 |
Attorney, Agent or Firm:
Nozomi Watanabe
Haruko Sanwa
Hideaki Ito
Haruko Sanwa
Hideaki Ito