Title:
金メッキ液の処理方法
Document Type and Number:
Japanese Patent JP6795821
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a processing method for removing an iron ion from gold plating liquid containing the iron ion.SOLUTION: The processing method of the gold plating liquid comprises a step of bringing the gold plating liquid containing the iron ions and citric acid into contact with a chelating agent having a functional group containing phosphorus to remove the iron ions. The phosphorus-containing functional group is preferably a phosphonic acid group or a phosphoric acid group. The gold plating liquid to be processed is preferably electrolytic gold plating liquid.SELECTED DRAWING: None
Inventors:
Tadahiko Nanbu
Nobuyoshi Nanbu
Hirokazu Morita
Nobuyoshi Nanbu
Hirokazu Morita
Application Number:
JP2016211442A
Publication Date:
December 02, 2020
Filing Date:
October 28, 2016
Export Citation:
Assignee:
Killest Co., Ltd.
Chubu Killest Co., Ltd.
Chubu Killest Co., Ltd.
International Classes:
C25D21/18; B01J45/00; C02F1/42; C25D3/48
Domestic Patent References:
| JP63054800B2 | ||||
| JP64004256A | ||||
| JP4171050A | ||||
| JP2009185338A | ||||
| JP2002309400A |
Other References:
伊勢武一ほか,Au-ZrB2分散めっきの表面特性,金属表面技術,1988年,Vol.39, No.3,pp.128-133,特に「1.緒言」
下条武美ほか,パルス電源を用いたコネクター接点の金めっき,実務表面技術,1985年,Vol.32, No.12,pp. 652-658,特に「4-4 コネクターの表面処理」
下条武美ほか,パルス電源を用いたコネクター接点の金めっき,実務表面技術,1985年,Vol.32, No.12,pp. 652-658,特に「4-4 コネクターの表面処理」
Attorney, Agent or Firm:
Asfi International Patent Office
Kyuichi Ueki
Hisahiko Ueki
Tadashi Sugakawa
Hiroaki Ito
Kyuichi Ueki
Hisahiko Ueki
Tadashi Sugakawa
Hiroaki Ito