Title:
マイカ紙中の微細孔の処理方法
Document Type and Number:
Japanese Patent JP5383507
Kind Code:
B2
Abstract:
A method for the treatment of micro pores within a mica paper that includes: obtaining a silane with a molecular weight of between approximately 15 and 300, adding the silane to the mica paper, and reacting the silane with the inner surface of the micro pores within the mica paper. After this, a resin is impregnated into the mica paper, and the resin binds to the inner surfaces of the micro pores with the mica paper through the silane. In one embodiment, the mica paper is compressed by an amount between 5% and 30% of its original thickness. In another embodiment, the mica paper is compressed both prior to reacting the silane and during impregnation with the resin.
Inventors:
Stevens, Gerry
Smith, James Dee Bee
Wood, Joan W
Smith, James Dee Bee
Wood, Joan W
Application Number:
JP2009546399A
Publication Date:
January 08, 2014
Filing Date:
January 09, 2008
Export Citation:
Assignee:
Siemens Energy Incorporated
International Classes:
H01B17/60; C08G77/04; C08J5/06; H01B19/02; H01F5/06
Domestic Patent References:
| JP11345733A |
Foreign References:
| WO2005123825A2 |
Attorney, Agent or Firm:
Iwao Yamaguchi