To provide a hybrid integrated circuit device for acceleration detecting having a high yield and a high quality.

A semiconductor strain sensor element 2 is assembled on a thick film substrate 1 via conductive solder bump electrodes 8. The semiconductor strain sensor element 2 is constituted of a mass retention part 2b, an acceleration sensing part 2a on which a piezoresistance layer is provided, a terminal part 2c fixed on the solder bump electrodes 8 and a balance supporting part 2d. An electric signal from the semiconductor strain sensor element 2 is connected with a pattern wiring 7 provided on the thick film substrate 1 via the solder bump electrodes 8. A distance W between the thick film substrate 1 and the mass supporting part 2b is decided by the solder bump electrodes 8. When an acceleration is applied to a hybrid integrated circuit device 10 for acceleration detecting which is constituted of the above, the acceleration sensing part 2a, the mass retention part 2b and the balance retention part 2b oscillate in different oscillation modes above the solder bump electrodes 8 in unbalanced states while they give their influences on each other.