To provide a hybrid integrated circuit device in which the occurrence of a defective power element can be prevented by lessening a shearing force being generated at the bonding part of the power element and a wire member.

The power element 20 and a land 13 at the conductor wiring part 12 are connected with a wire member 40 of aluminum, or the like. One end of the wire member 40 is bonded to a cell region 22 of the power element 20. The wire member 40 is arranged to have a fixing angle, i.e., the angle between the upper end face 20a of the power element 20 and the wire member 40, of 30° or large. Consequently, the loop shape top 40a of the wire member 40 is located higher than the upper end face 20a. Consequently, since durability of the power element 20 is enhanced, occurrence of a defective power element 20 can be prevented, even if a shearing force is generated at the bonding part of the wire member 40 and the power element due to the difference in thermal expansion.