PURPOSE: To prevent the deformation of gold wires, at the time or resin sealing by a transfer mold method, by arranging a rectangular parallelopiped substrate having a specified thickness, at a specified position on a printed wiring board.

CONSTITUTION: A printed wiring board 2 is stuck on a lead frame 1; a semiconductor chip 3 is die bonded to a printed wiring board 2; a rectangular parallelopiped insulating substrate 4 made of epoxy based resin is mounted by using insulative paste, and said paste is cured. By using gold wires 5, specified electrodes of the semiconductor chip 3 and specified electrodes of the printed wiring board 2 are wire-bonded. Resin sealing is performed by a transfer mold method using resin 6, and a hybrid integrated circuit is obtained. In this process, the insulating substrate 4 serves as a barrier to prevent the deformation of the gold wires, and prevents the deformation of the gold wires.