Title:
HYBRID INTEGRATED CIRCUIT
Document Type and Number:
Japanese Patent JPH0590435
Kind Code:
A
Abstract:
PURPOSE: To solder securely a chip part on a solder land of a substrate, the chip part being relatively light and easy to fix on the substrate.
CONSTITUTION: Dielectric layers 14a and 14b are sandwiched between each inner end 13a1 and 13b1 of a pair of solder lands 13a and 13b formed on a substrate 12 with a sublayer conductor and the substrate 12, and thereby the solder lands are raised up.
Inventors:
NOGAMIDA WATARU
TOGAWA TOSHIFUMI
TOGAWA TOSHIFUMI
Application Number:
JP25147591A
Publication Date:
April 09, 1993
Filing Date:
September 30, 1991
Export Citation:
Assignee:
TOSHIBA LIGHTING & TECHNOLOGY
TOSHIBA AVE KK
TOSHIBA AVE KK
International Classes:
H01L23/12; H05K1/18; H05K3/34; H05K3/40; (IPC1-7): H01L23/12; H05K1/18; H05K3/34
Attorney, Agent or Firm:
Hisano Hatano (1 person outside)
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