PURPOSE: To prevent a hybrid laminated circuit device from changing in temperature characteristics due to heat release by a method wherein a cavity induced by a level difference between a hybrid laminated circuit component and a board is filled with a thermal conductor.

CONSTITUTION: A capacitor layer 2 is structured in such a manner that capacitor networks 21-27 are buried in a dielectric porcelain 20, and the capacitor networks 21-27 are constituted through such a way that capacitors formed by making electrodes opposed to each other through the intermediary of a dielectric porcelain layer are so connected to constitute required capacitor circuits, where the capacitor networks 21-27 are connected to either of connection terminals 5 to lead outside. A level difference G1 equal to the thickness of the terminal 5 is induced between the connection terminal 5 and a coil layer 1 of the laminated passive composite body. The cavity formed between a board 8 and the coil layer 1 of the laminated passive composite body due to the level difference G1 is filled with a thermal conductor 6 which is formed of electrical conductor material such as metal or resin material excellent in thermal conductivity such as silicone compound.