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Title:
HYDROFORMING LUBRICANT, HYDROFORMING METALLIC TUBE USING IT, AND HYDROFORMING PROCESSING METHOD
Document Type and Number:
Japanese Patent JP2009108168
Kind Code:
A
Abstract:

To provide a hydroforming lubricant, which exhibits excellent lubrication and seizure preventing performance to prevent break, buckling, damage on the surface during a hydroforming process and can be removed after the molding process; a hydroforming metallic tube using the lubricant, and a hydroforming processing method.

The hydroforming lubricant comprises 0.1-10 wt.% of wax with a melting point 45-110C on a solid weight basis, and the rest of the hydroforming lubricant consists of at least one of a soluble aqueous resin and a surfactant. Preferably, the wax consists of one or more kinds of wax among carnauba wax, lanolin, and paraffin, while the soluble aqueous resin consists of one or more kinds of resin among acrylic resin with molecular weight of 5,000-100,000, polyalkylene glycol with molecular weight of 800-35,000, urethane resin, polylactic acid, and polyvinyl alcohol.


Inventors:
WATANABE TAKAMICHI
HOSOMI KAZUHIRO
UEDA KAORU
HATSUNO KEIICHIRO
Application Number:
JP2007280818A
Publication Date:
May 21, 2009
Filing Date:
October 29, 2007
Export Citation:
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Assignee:
SUMITOMO LIGHT METAL IND
International Classes:
C10M169/04; B21D26/02; B21D26/037; B21D37/18; C10M101/02; C10M105/04; C10M107/04; C10M109/00; C10M129/26; C10M133/16; C10M135/10; C10M137/02; C10M137/04; C10M145/04; C10M145/22; C10M145/26; C10M145/36; C10M145/38; C10M149/20; C10N20/00; C10N20/04; C10N30/06; C10N40/24; C10N50/00; C10N80/00
Domestic Patent References:
JPH11290963A1999-10-26
JP2001140080A2001-05-22
JP2002363591A2002-12-18
JP2003154414A2003-05-27
JPH10137863A1998-05-26
JPH1088364A1998-04-07
JP2003062927A2003-03-05
JP2005068178A2005-03-17
JP2000309747A2000-11-07
JPH11290963A1999-10-26
JP2001140080A2001-05-22
JP2002363591A2002-12-18
JP2003154414A2003-05-27
JPH10137863A1998-05-26
JPH1088364A1998-04-07
Attorney, Agent or Firm:
Patent Business Corporation Aichi International Patent Office



 
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