Title:
親水化処理用組成物及び親水化処理方法
Document Type and Number:
Japanese Patent JP4063375
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a composition which can give a coating film excellent in hydrophilicity retention, corrosion resistance, etc., by including a water-soluble polyamide resin, a polyoxyethylene-chain-containing water-soluble resin, and specified hydrophilic crosslinked polymer microparticles. SOLUTION: This composition comprises a water-soluble polyamide resin, a water-soluble resin having at least 40 wt.% polyoxyethylene chains and/or polyoxypropylene chains, and hydrophilic crosslinked polymer microparticles comprising a copolymer comprising 2-50 wt.% hydrophilic monomer having a polymerizable double bond and a polyoxyalkylene chain or a polyvinylpyrrolidone chain, 20-97 wt.% monomer represented by the formula, 1-30 wt.% crosslinking unsaturated monomer selected among compounds having at least two polymerizable double bonds and compounds having a functional group selected among a hydrolyzable silyl group, an epoxy group, an N-methylol group, and an N-alkoxymethyl group and one polymerizable double bond, and 2-50 wt.% COOH-containing polymerizable unsaturated monomer. In the formula, R<1> is H or CH3 ; and R2 and R3 are each H or a 1-5C alkyl (the sum of the C numbers is 5 or below).
Inventors:
Tayuki Noboru
Kunihiro
Kunihiro
Application Number:
JP34385797A
Publication Date:
March 19, 2008
Filing Date:
November 28, 1997
Export Citation:
Assignee:
KANSAI PAINT CO.,LTD.
International Classes:
C09D177/00; B05D5/00; F28F13/18; B05D7/14; C08F290/00; C08F290/06; C08L67/07; C08L71/02; C08L77/00; C09D5/00; C09D5/14; C09D7/12; C09D9/04; C09D133/24; C09D155/00; C09D167/07; C09D171/00; C09D171/02; C23C22/00; C23C22/66; C23C22/74
Domestic Patent References:
| JP3819956B2 | ||||
| JP3488929B2 |
Attorney, Agent or Firm:
Heikichi Odashima
Youji Esumi
Osamu Yasuda
Youji Esumi
Osamu Yasuda