Title:
水酸基含有マレイミド化合物
Document Type and Number:
Japanese Patent JP6977257
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a new hydroxyl group-containing maleimide compound excellent in a mechanical strength and a cure rate of an epoxy resin.SOLUTION: There provided a maleimide compound having a specific structure and a phenolic hydroxyl group; a composition containing the compound; a composition further containing an epoxy compound; a cured product formed by curing the composition and a laminate having the cured product and a base material; and a composition for heat resistant material and a composition for electronic material containing the composition.SELECTED DRAWING: None
Inventors:
Kazuo Arita
Etsuko Suzuki
Ritsu Otsu
Etsuko Suzuki
Ritsu Otsu
Application Number:
JP2016246563A
Publication Date:
December 08, 2021
Filing Date:
December 20, 2016
Export Citation:
Assignee:
DIC Corporation
International Classes:
C07D207/452; B32B27/00; C08G59/40; C08J5/24; H01L23/14; H01L23/29; H01L23/31
Domestic Patent References:
| JP63201166A | ||||
| JP3000725A | ||||
| JP57074328A | ||||
| JP2009161605A | ||||
| JP4153214A |
Attorney, Agent or Firm:
Shinji Ogawa
Akihiro Iwamoto
Takayuki Ohno
Akihiro Iwamoto
Takayuki Ohno