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Title:
HYGROSCOPIC MOLDED ARTICLE
Document Type and Number:
Japanese Patent JP2001354780
Kind Code:
A
Abstract:

To provide a material capable of absorbing easily and surely moisture penetrating into the inside of an apparatus such as an electronic device or the like.

The hydroscopic molded body is such a molded body that contains a moisture-absorbing agent and a resin component and that has one or two or more of through-holes.


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Inventors:
KAWAGUCHI YOHEI
FUJIMORI MASAYUKI
OYAMA KANEHITO
Application Number:
JP2000175746A
Publication Date:
December 25, 2001
Filing Date:
June 12, 2000
Export Citation:
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Assignee:
DYNIC CORP
International Classes:
C08J7/04; B29C70/58; C08J5/00; C08K3/22; C08K3/30; C08K7/24; C08L101/12; H01G2/02; (IPC1-7): C08J5/00; B29C70/58; C08J7/04; C08K3/22; C08K3/30; C08K7/24; C08L101/12
Attorney, Agent or Firm:
Eiji Saegusa (8 others)



 
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