Title:
ＩＣ検査用ソケット
Document Type and Number:
Japanese Patent JP7390161
Kind Code:
B2
Abstract:
An IC inspection socket (10) includes: a pin block (30) having a contact probe array (60); a guiding plate (40) that guides an inspection-target IC package to the contact probe array (60); and a cover (50) that presses down the guiding plate by means of engagement of an engaging section that engages with the pin block (30). The pin block (30) has: a support section (70) that supports the guiding plate (40) in an attachable/detachable manner; and an engaged section (36) with which the engaging section engages as a result of the cover (50) moving in a sliding manner on the supported guiding plate (40).
Inventors:
Kohei Amada
Yuki Matsui
Yuki Matsui
Application Number:
JP2019198311A
Publication Date:
December 01, 2023
Filing Date:
October 31, 2019
Export Citation:
Assignee:
Yokoo Co., Ltd.
International Classes:
H01R33/76; G01R31/26; H01R13/24
Domestic Patent References:
| JP2012015024A | ||||
| JP2000133398A | ||||
| JP2017208306A | ||||
| JP2004006170A | ||||
| JP10222092A |
Attorney, Agent or Firm:
Yasushi Kuroda
Noboru Takekoshi
Hajime Inoue
Noboru Takekoshi
Hajime Inoue