Title:
MOLDING DIE AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JPH0747567
Kind Code:
A
Abstract:
PURPOSE: To provide a molding die capable of molding a lead frame of multi-pin having no dam bar with resin assuredly and easily.
CONSTITUTION: A molding die is provided for molding with resin a lead frame 10 having no dam bar and is provided with dam blocks 18 formed in positions between the leads of the lead frame 10 in accordance with a lead pattern. The dam blocks 18 are formed by electro-discharge machining with an electrode formed by etching process in accordance with a lead pattern of an outer lead 16.
Inventors:
YAMAGUCHI TATSUYOSHI
Application Number:
JP19449893A
Publication Date:
February 21, 1995
Filing Date:
August 05, 1993
Export Citation:
Assignee:
APIC YAMADA KK
International Classes:
B29C33/38; B29C45/02; B29C45/14; B29C45/26; H01L21/56; B29K105/20; B29L31/34; (IPC1-7): B29C45/26; B29C33/38; B29C45/14; H01L21/56
Attorney, Agent or Firm:
Takao Watanuki (1 outside)
Next Patent: INJECTION MOLDING DEVICE AND METHOD