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Patent Searching and Data


Title:
【発明の名称】レイヤ-バイ-レイヤプロセスを用いるフリースタンディング膜の組立
Document Type and Number:
Japanese Patent JP2003528755
Kind Code:
A
Abstract:
A method for the layer-by-layer assembly of a free standing thin film includes the steps of preparing a support with a suitable substrate; forming a thin film having a plurality of layers onto the substrate utilizing a layer-by-layer assembly process; removing the substrate and thin film from the support; and separating the substrate from the thin film. Various compounds improving the strength, flexibility, tension and other mechanical properties may be included in the assembly to improve the structural quality of the film. Similar effect may also be achieved by cross-linking the applied layers.

Inventors:
Kotov, Nicholas A.
Application Number:
JP2001571803A
Publication Date:
September 30, 2003
Filing Date:
March 27, 2001
Export Citation:
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Assignee:
The Board of Regents for Oklahoma State University
International Classes:
B01D69/12; B01D69/14; B01D71/02; B05D1/18; B29C41/14; B29C41/22; B29D7/01; C08J5/18; B05D7/00; (IPC1-7): B29C41/22; B29C41/14; C08J5/18
Foreign References:
WO2000044507A12000-08-03
WO2000044507A12000-08-03
Attorney, Agent or Firm:
Kazuo Shamoto (5 outside)