Title:
【発明の名称】ワイヤボンダ用ボール形成装置
Document Type and Number:
Japanese Patent JP2835989
Kind Code:
B2
Abstract:
In a method and apparatus for making uniform size balls at the end of bonding wires, a constant current circuit is installed between a high voltage power source and a discharge electrode so that a constant high voltage is applied between the bonding wire end and the discharge electrode and a discharge voltage is detected by a discharge voltage detecting circuit so that the thus detected discharge voltage is converted into a time so that a discharge time setting circuit which controls the constant current circuit regulates the discharge time period of the high voltage.
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| JPH06224198 | BALL JUNCTION FOR FLIP CHIP DEVICE |
Inventors:
TERAKADO YOSHIMITSU
SASAKURA KAZUMASA
SASAKURA KAZUMASA
Application Number:
JP14812591A
Publication Date:
December 14, 1998
Filing Date:
May 24, 1991
Export Citation:
Assignee:
SHINKAWA KK
International Classes:
H01L21/60; B23K20/00; (IPC1-7): H01L21/60
Domestic Patent References:
| JP245944A | ||||
| JP2181943A | ||||
| JP63136640A | ||||
| JP5740947A | ||||
| JP63119540A | ||||
| JP6039840A | ||||
| JP2108337U |
Attorney, Agent or Firm:
Yoshinori Tanabe