PURPOSE: To miniaturize a surface acoustic wave (SAW) device and to reduce cost.

CONSTITUTION: An insulated holding frame 20 with beads is formed so that terminal electrodes 5 and 5' can be positioned outside while surrounding an oscillating functional plane 7 of a SAW element 1 equipped with an IDT and the terminal electrodes 5 and 5' on a piezoelectric substrate 2. By placing an insulated upper panel 21 from the upside of that frame 20 and curing it, the oscillating functional plane 7 is protected and air-tight sealing is performed. Thus, since no package is required and many elements can be simultaneously air-tightly sealed in a wafer state, the device is miniaturized at low cost.