Title:
【発明の名称】複合予備成形体、モジュール及び構造体
Document Type and Number:
Japanese Patent JP3080742
Kind Code:
B2
Abstract:
A composite preform or module comprises a filamentary reinforcement (16) deposited in a groove (12,44,46,32) pre-formed in a metal or ceramic foil (10,40,42). By depositing the filamentary reinforcement (16) in a groove (12,44,46,32) its position and distribution can be readily determined and held during consolidation of the preform. A plurality of preforms (modules) can be laid together to provide a described structure. The filamentary reinforcement (16) is held in place by, for example, a fugitive binder (36) and grooves 18 allow for the off-gassing of the binder during consolidation.
Inventors:
Stephen Dee Keck
Harlan El Woods
Harlan El Woods
Application Number:
JP34974091A
Publication Date:
August 28, 2000
Filing Date:
December 10, 1991
Export Citation:
Assignee:
Textron Systems Corporation
International Classes:
B28B23/02; B29C70/46; B29C70/54; B32B3/08; B32B3/30; B32B5/02; B32B7/12; B32B15/01; B32B15/08; B32B15/14; B32B18/00; C22C29/00; C22C47/00; C22C47/06; C22C47/20; (IPC1-7): B32B15/08; B28B23/02; B32B5/02; B32B7/12
Domestic Patent References:
| JP6156261A |
Attorney, Agent or Firm:
Motohiro Kurauchi (1 outside)