【発明の名称】電子部品封止用組成物

Title:

【発明の名称】電子部品封止用組成物

Document Type and Number:

Japanese Patent JP2525207

Kind Code:

B2

Inventors:

AOZAI FUMITO
FUKUSHIMA HIROSHI
HADO HISAKO

Application Number:

JP23816187A

Publication Date:

August 14, 1996

Filing Date:

September 22, 1987

Export Citation:

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Assignee:

MITSUBISHI RAYON CO

International Classes:

C08F299/00; C08F290/00; C08F290/04; C08F290/06; C08F299/02; H01L23/29; H01L23/31; (IPC1-7): C08F290/04; C08F290/06; C08F299/00; C08F299/02; H01L23/29; H01L23/31

Domestic Patent References:

JP5466074A
JP57102601A
JP5993708A

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