Title:
【発明の名称】相互接続のためのコンタクト構造、介在体、半導体アセンブリおよび方法
Document Type and Number:
Japanese Patent JP3006885
Kind Code:
B2
Abstract:
An interconnection contact structure assembly including an electronic component (102) having a surface and a conductive contact terminal (103) carried by the electronic component (102) and accessible at the surface. The contact structure (101) includes an internal flexible elongate member (106) having first (107) and second ends (108) and with the first end (107) forming a first intimate bond to the surface of the conductive contact terminal (103) without the use of a separate bonding material. An electrically conductive shell (116) is provided and is formed of at least one layer of a conductive material enveloping the elongate member (106) and forming a second intimate bond with at least a portion of the conductive contact terminal immediately adjacent the first intimate bond.
Inventors:
Candros, Igor Wai
Matthew, Getan El
Matthew, Getan El
Application Number:
JP51463994A
Publication Date:
February 07, 2000
Filing Date:
November 16, 1994
Export Citation:
Assignee:
Form Factor Incorporated
International Classes:
H01L23/12; C23C18/16; C25D7/12; G01R1/04; G01R1/067; G01R1/073; G01R31/26; G01R31/28; H01L21/00; H01L21/48; H01L21/56; H01L21/60; H01L21/66; H01L23/32; H01L23/48; H01L23/485; H01L23/49; H01L23/498; H01L25/065; H01L25/07; H01L25/16; H01L25/18; H01R4/02; H01R9/00; H01R33/76; H05K3/30; H05K3/32; H05K3/34; H05K3/40; H05K7/10; G01R3/00; H01R12/52; H05K1/14; H05K3/36; (IPC1-7): H01R12/32; H01R4/02; H01R33/76
Attorney, Agent or Firm:
Fukami Hisaro (3 outside)