Title:
SOLDER JET SYSTEM
Document Type and Number:
Japanese Patent JPH0832221
Kind Code:
A
Abstract:
PURPOSE: To obtain a solder jet system realizing high quality soldering while enhancing the maintainability.
CONSTITUTION: Supply parts 17a, 17a,... of a nitrogen supply pipe 17 are disposed on the surface of solder bath 11 in a soldering system A below the carrying line L of printed board. Each supply part 17a is provided, in the rear surface with a nitrogen supply port 18, 18,... through which nitrogen gas is blown against the surface of motel solder M in the solder bath 11.
Inventors:
TOYOSHITA SOTOJI
Application Number:
JP16157794A
Publication Date:
February 02, 1996
Filing Date:
July 13, 1994
Export Citation:
Assignee:
KOMATSU GIKEN KK
International Classes:
B23K31/02; B23K1/08; H05K3/34; (IPC1-7): H05K3/34; B23K1/08; B23K31/02
Attorney, Agent or Firm:
Masatake Shiga (2 outside)
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