Title:
【発明の名称】シクロペンチレン化合物ならびにその中間体、エポキシ樹脂組成物、成形材料および樹脂封止型電子装置
Document Type and Number:
Japanese Patent JP3199754
Kind Code:
B2
Abstract:
This invention provides a compound suitable as an encapsulating material for electronic devices and having a high Tg, low moisture-absorptive, high adhesion and rich fluidity, which is a cyclopentylene compound represented by Formula (I) and its intermediate cyclopentenyl compound represented by Formula (III). In the formula, m is 0 or more, Ar1 and Ar2 are each a phenol residual group, a naphthol residual group or a fluorene derivative residual group, and each contain a hydroxyl group or a glycidyloxyl group.
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Inventors:
Haruaki Sue
Shinsuke Hagiwara
Fumio Furusawa
Seiichi Akagi
Akihiro Kobayashi
Hidenori Yokoyama
Shinsuke Hagiwara
Fumio Furusawa
Seiichi Akagi
Akihiro Kobayashi
Hidenori Yokoyama
Application Number:
JP52453698A
Publication Date:
August 20, 2001
Filing Date:
December 01, 1997
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
C07C39/17; C07D301/28; C08G59/24; C08G59/32; C08L63/00; H01L23/29; (IPC1-7): C08G59/20; C07C39/17; C07C39/42; C07D303/24; C08G59/62; C08K3/00; C08L63/00; H01L23/29; H01L23/31
Domestic Patent References:
| JP4872159A | ||||
| JP60135427A | ||||
| JP4714094B1 |
Attorney, Agent or Firm:
Kazuko Tomita (1 outside)