Title:
【発明の名称】ダイ取付接着剤組成物
Document Type and Number:
Japanese Patent JP2002503263
Kind Code:
A
Abstract:
A novel thermally reworkable die attach adhesive composition for attaching a semiconductor device to a substrate is provided. The composition comprises (a) a thermally reworkable crosslinked resin produced by reacting at least one dienophile having a functionality greater than one and at least one 2,5-dialkyl substituted furan-containing polymer, and (b) at least one thermally and/or electrically conductive material present in an effective amount up to about 90% by weight of the die attach composition to provide a conducting medium.
Inventors:
Ia, Siridal Ratnaswami
Wuong, Piyu Kwan
Wuong, Piyu Kwan
Application Number:
JP52734398A
Publication Date:
January 29, 2002
Filing Date:
December 15, 1997
Export Citation:
Assignee:
Ciel International Research Mart Shats Pay BV
International Classes:
C08G67/02; C09J9/02; H01L21/52; H01L21/58; H01L21/60; H01L23/495; (IPC1-7): C09J9/02; C08G67/02; H01L21/52
Attorney, Agent or Firm:
Yoshio Kawaguchi (2 outside)