PURPOSE: To obtain a resin casting material for electronic component being employed in various electronic appliances which exhibits high workability at the time of casting, and to produce a resin molded electronic component having excellent quality and high frequency characteristics by adding a hardened material having low internal stress and low dielectric constant.

CONSTITUTION: A base resin, i.e., a silicon resin matrix 1, is admixed with filler, i.e., hollow beads 2 of spherical silica, in order to enhance workability at the time of casting. It is further admixed with a hardened material having low internal stress and low dielectric constant thus obtaining a resin casting material for producing an electronic component having high quality and excellent high frequency characteristics.