Title:
【発明の名称】半導体封止用エポキシ樹脂硬化剤および組成物
Document Type and Number:
Japanese Patent JP2797964
Kind Code:
B2
More Like This:
Inventors:
Masato Ohira
Yoshihisa Sone
Yoshihisa Sone
Application Number:
JP10128494A
Publication Date:
September 17, 1998
Filing Date:
May 16, 1994
Export Citation:
Assignee:
SUMITOMO METAL INDUSTRIES,LTD.
Sumikin Chemical Co., Ltd.
Sumikin Chemical Co., Ltd.
International Classes:
C08L61/04; C08G59/62; C08K3/00; C08L63/00; H01L23/29; H01L23/31; (IPC1-7): C08G59/62; C08K3/00; C08L63/00; H01L23/29; H01L23/31
Domestic Patent References:
| JP390075A | ||||
| JP7292073A |
Attorney, Agent or Firm:
Hirose Shoichi