Title:
【発明の名称】リード間異物検査法
Document Type and Number:
Japanese Patent JP3056155
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To accurately and easily inspect inter-lead foreign matters such as lead burrs and tie bars. SOLUTION: A reference image and an image for inspection are sampled by an image sampling part 1 and are registered into a registered image memory 2 and an image memory 3, respectively. A pattern matching circuit 4 performs pattern matching to detect the positions of leads. A lead edge circuit 5 calculates the end, root, and side edge of each lead on an IC and their thresholds. A labeling area acquisition circuit 8 sets a scan line between the leads, and sets an inspection area where labeling is performed. When a defective pixel is present on the scan line, a defective judging circuit 9 performs labeling and inspects whether or not the defective pixel continues up to the lead edge.
Inventors:
Mitsuhiro Okawa
Application Number:
JP33424597A
Publication Date:
June 26, 2000
Filing Date:
December 04, 1997
Export Citation:
Assignee:
Asia Electronics Co., Ltd.
International Classes:
G01B11/02; G01N21/88; G01N21/93; G01N21/94; G01N21/95; G01N21/956; G06T1/00; G06T7/00; (IPC1-7): G01N21/95; G01B11/02; G01N21/88; G06T7/00
Domestic Patent References:
| JP498148A | ||||
| JP814845A |
Attorney, Agent or Firm:
Takehiko Suzue (6 outside)