Title:
【発明の名称】改良研磨スラリー及びその使用方法
Document Type and Number:
Japanese Patent JPH11511394
Kind Code:
A
Abstract:
An aqueous slurry is provided for polishing or planarizing a work piece which contains a metal, the solids portion of said slurry being comprised of 1 to 50 percent by weight of submicron alpha-alumina, the remainder of the solids being of a substantially less abrasive composition chosen from the group consisting of aluminum hydroxides, gamma-alumina, delta-alumina, amorphous alumina, and amorphous silica. Also provided is a method for polishing the surface of a work piece which contains a metal wherein said aqueous slurry is used as the polishing composition during chemical-mechanical polishing.
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Inventors:
One Jin-Fan
Sedraman Anansa
One Hey-Min
Cook Lee Melbourne
Sedraman Anansa
One Hey-Min
Cook Lee Melbourne
Application Number:
JP51527997A
Publication Date:
October 05, 1999
Filing Date:
October 04, 1996
Export Citation:
Assignee:
Rhodel Incorporated
International Classes:
B24B37/00; C09G1/02; C09K3/14; C23F1/00; C23F3/00; H01L21/304; (IPC1-7): B24B37/00; C23F1/00; H01L21/304
Attorney, Agent or Firm:
Kazuyoshi Tsujimoto