Title:
【発明の名称】集積回路超小型衛星
Document Type and Number:
Japanese Patent JP3432497
Kind Code:
B2
Abstract:
A plurality of silicon and GaAs wafers each including integrated circuitry for providing particular functions for each wafer are mounted within a housing in a stacked, spaced apart, and parallel configuration. Photodetectors and LED's are used to transmit and receive data between opposing wafers. In this manner a micro-packaged device or system is obtained for use amongst other things in lightweight miniaturized microsatellites.
Inventors:
Josiah Bay M
Application Number:
JP2000518425A
Publication Date:
August 04, 2003
Filing Date:
October 23, 1998
Export Citation:
Assignee:
Discovery Semiconductors, Inc.
International Classes:
B64G1/10; B64G1/66; H01Q1/28; H01Q1/36; H01Q1/38; H01Q11/04; (IPC1-7): B64G1/10; H01Q1/28; H01Q11/04
Domestic Patent References:
| JP53340A |
Other References:
【文献】米国特許3999105(US,A)
Attorney, Agent or Firm:
Hiroshi Takeuchi
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