Title:
【発明の名称】集積回路試験ソケット蓋部組立品
Document Type and Number:
Japanese Patent JP2003527609
Kind Code:
A
Abstract:
A test socket for integrated circuits includes a socket body for making electrical connection between leads or pads of an integrated circuit and a load board. A lid assembly is pivotally connected to the socket body by a hinge and is rotatable between a closed position and an open position. The lid assembly is removable from the socket body without tools. The lid assembly includes a frame member secured to the hinge, and a pressure plate and actuation member contained within the frame member. The bottom surface of the pressure plate includes a plurality of channels extending from an open central portion to the circumference of the pressure plate for permitting thermal air flow over the integrated circuit. A preferred embodiment of the lid assembly provides a visual indication to the user when an integrated circuit is undergoing testing.
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Inventors:
Heather Wye Kiff
Application Number:
JP2001568096A
Publication Date:
September 16, 2003
Filing Date:
February 22, 2001
Export Citation:
Assignee:
3M Innovative Properties Company
International Classes:
G01R1/04; G01R1/073; H01R33/76; G01R31/26; (IPC1-7): G01R1/073; G01R31/26; H01R33/76
Attorney, Agent or Firm:
Aoyama Ryo (2 outside people)